ANNEX

Annex to Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment
is amended as follows:

1) Point 7 is replaced by the following:

“7. — Lead in high melting temperature type solders (i.e. lead based alloys containing 85 % by weight or more lead),

— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications,

— lead in electronic ceramic parts (e.g. piezoelectronic devices).”

2) Point 8 is replaced by the following:

“8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations.”

3) Point 10 is replaced by points 10 to 15 as follows:

“10. Lead used in compliant pin connector systems.

11. Lead as a coating material for the thermal conduction module c-ring. 

12. Lead and cadmium in optical and filter glass.

13. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight.

14. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

15. In the context of the procedure referred to in Article 7(2), the Commission shall evaluate applications for Deca BDE and light bulbs.

It shall do so as a matter of priority in order to establish as soon as possible whether those items are to be amended accordingly.”